| HS Code | 707656 |
| Product Name | Phenol For Electronics |
| Chemical Name | Phenol |
| Chemical Formula | C6H5OH |
| Cas Number | 108-95-2 |
| Appearance | Colorless crystalline solid |
| Purity | ≥99.5% |
| Melting Point | 40.5°C |
| Boiling Point | 181.7°C |
| Flash Point | 79°C |
| Density | 1.07 g/cm³ at 25°C |
| Solubility In Water | 8.3 g/100 mL at 20°C |
| Vapor Pressure | 0.36 mmHg at 20°C |
| Refractive Index | 1.5418 at 40°C |
As an accredited Phenol For Electronics factory, we enforce strict quality protocols—every batch undergoes rigorous testing to ensure consistent efficacy and safety standards.
| Packing | Phenol For Electronics is packaged in 25 kg HDPE drums with secure, corrosion-resistant lids, ensuring purity and safe handling. |
| Container Loading (20′ FCL) | 20′ FCL of electronics-grade phenol, packed in sealed drums on pallets, secured to prevent leakage and moisture contamination. |
| Shipping | Phenol for Electronics is classified as a hazardous material (UN1671, Class 6.1, PG II). It ships via ground transport only, in tightly sealed, corrosion-resistant containers with proper hazard labeling. Documentation includes a dangerous goods declaration, and handling requires protective equipment to prevent exposure during transit. |
| Storage | Store Phenol for Electronics in tightly sealed, chemically resistant containers (e.g., stainless steel or glass) in a cool, dry, well-ventilated area. Keep away from heat, sparks, open flames, and incompatible substances such as oxidizing agents, strong acids, and bases. Ensure secondary containment to prevent leaks and contamination. |
| Shelf Life | Shelf life: 12 months if stored tightly sealed, protected from light, and kept below room temperature. |
Electronic-grade phenol sourced for integrated circuit packaging operations enters the supply chain under a certification of purity that far exceeds industrial bulk phenol. The compound must carry no more than 0.1 ppm iron, 0.05 ppm sodium, and 0.02 ppm potassium, with a solidification point not lower than 40.6 °C to exclude homologous cresols and xylenols that would destabilise subsequent condensation kinetics. In the synthesis of novolac hardeners destined for epoxy moulding compounds (EMC), this phenol is reacted with formalin under oxalic acid catalysis in a glass-lined kettle, maintaining a molar ratio of formaldehyde to phenol below 0.80 to guarantee a random thermoplastic architecture with methylene bridges predominantly at the ortho-para positions. The resin is then stripped under vacuum at 180 °C until free phenol drops below 0.1 % by weight — a boundary set by the outgassing threshold during transfer moulding, where residual volatiles cause wire sweep and internal void formation in thin quad flat packages (TQFP). Hydroxyl equivalent weight is titrated to fall between 104 and 108 g/eq, and the molecular weight distribution is monitored via GPC, targeting a polydispersity index of 2.2–2.8. These parameters directly govern spiral flow length measured according to ASTM D3123-09 at 175 °C and 7 MPa transfer pressure: a spread narrower than 75–125 cm flags insufficient mould fill for large-die multi-row BGA matrices, while values exceeding 140 cm correlate with flash bleed and wire bond distortion. The EMC formulation itself blends 100 parts ortho-cresol novolac epoxy with 53 parts phenol novolac hardener, filled to 86–88 wt% with spherical fused silica and an additional 0.8 parts triphenylphosphine catalyst. After twin-screw compounding at a barrel temperature profile of 90–110 °C and die-face pelletising, the compound is stored at 5 °C and conditioned for 4 hours at 23 °C before moulding. Transfer moulding proceeds at 175–185 °C with a clamp force of 80–120 tonnes, followed by post-mould cure of 4 hours at 175 °C and an additional 2 hours at 200 °C to raise the glass transition temperature above 155 °C. Compliance with IPC/JEDEC J-STD-020E Level 1 moisture sensitivity demands that the moulded package, after conditioning at 85 °C/85 % RH for 168 hours, survives three reflow passes at peak 260 °C without delamination detectable by scanning acoustic microscopy.
Novolac resins for positive-tone photoresists are synthesised from electronic-grade phenol, meta-cresol, and para-cresol in ratios tailored to the required alkaline dissolution rate and thermal distortion temperature. A typical formulation for 0.5 µm i-line logic devices uses a phenolic co-monomer blend of 40 parts phenol, 35 parts meta-cresol, and 25 parts para-cresol, condensed with formaldehyde using hydrochloric acid until the weight-average molecular weight reaches 4 000–6 000 g/mol at a dispersion of 1.8–2.2. The resultant resin is dissolved in PGMEA and blended with a photoactive compound derived from 2,3,4-trihydroxybenzophenone esterified with naphthoquinone diazide sulfonyl chloride to an esterification degree of 32–38 %. Despite stripping, residual free phenol concentration in the solid resin inevitably persists in the 0.05–0.3 % range. Even the 0.2 % threshold proves critical: when resist films are spin-coated to 1.2 µm thickness on 200 mm bare silicon and soft-baked at 100 °C for 90 seconds, the dark erosion rate in 2.38 % tetramethylammonium hydroxide developer climbs from 0.8 nm/s to 2.5 nm/s as free phenol rises from 0.05 % to 0.3 %, destroying pattern contrast and reducing the remaining resist thickness post-development below the 800 nm needed for a safe plasma etch barrier. The anomaly stems from phenol’s plasticising effect on the novolac matrix, which accelerates the percolation of hydroxyl ions along hydrogen-bonded pathways through the matrix even in unexposed regions. Consequently, metal ion specifications in the phenol feedstock are enforced not only by bulk purity but by downstream dark loss: sodium and potassium are each capped at 20 ppb, iron at 30 ppb, and copper at 5 ppb as measured by ICP-MS after microwave digestion, aligning with SEMI C28 guidelines for process chemicals. The resist’s lithographic performance is validated by printing dense 0.45 µm line/space pairs with a 0.48 NA stepper at 200 mJ/cm² exposure dose, followed by post-exposure bake at 115 °C for 60 seconds and single-puddle development for 60 seconds, achieving a critical dimension uniformity of ±15 nm across the wafer.
In the route to benzoxazine resins for high-frequency printed circuit laminate, phenol undergoes a Mannich-type ring-closure with formaldehyde and a primary amine — typically aniline or 4,4′-diaminodiphenylmethane — at a molar ratio of 1.0:2.0:1.05 in refluxing toluene, producing a difunctional benzoxazine monomer with a latent viscosity below 50 mPa·s at 120 °C. The monomer is then combined with an aromatic diamine hardener, often sulfonyldianiline or a diamine-functional siloxane, and loaded with 45–55 vol% fused silica to tailor the coefficient of thermal expansion to 30–35 ppm/K below the glass transition. Curing proceeds through a thermal ring-opening polymerisation that avoids the release of volatiles, enabling void-free lamination. The prepreg is staged on 7628-style E-glass at 190 °C for 3 minutes to achieve 40 % resin flow, then pressed between copper foils at 200 °C under 35 kg/cm² for 90 minutes, with an unrestricted post-cure at 220 °C for 4 hours. Dielectric properties measured by the split-post resonator method per IPC-TM-650 2.5.5.9 at 10 GHz show a relative permittivity of 2.9–3.3 and a dissipation factor of 0.004–0.007, depending on the diamine spacer length; aliphatic spacers push Df below 0.005 but degrade heat resistance, limiting continuous-use temperature to 150 °C instead of the 180 °C achievable with sulfonyldianiline. The halogen-free flame retardancy is addressed by incorporating 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide (DOPO) at 8–12 phr, which depresses the peak heat release rate in cone calorimetry under ISO 5660-1 to below 100 kW/m² while maintaining a V-0 rating at 1.6 mm thickness. A processing window limitation arises at silica loadings above 60 vol%, where the melt viscosity rises beyond 10 000 Pa·s at 180 °C and causes resin starvation at the inner layers. Commercial laminators therefore operate with a viscosity stabilisation package comprising 2‑ethyl‑4‑methylimidazole microcapsules that activate after the flow plateau is reached.
Electronic-grade phenol intended for subsequent bisphenol-A (BPA) synthesis must present a water-white appearance with an APHA colour value below 10 and a total carbonyls content not exceeding 0.005 %, because even trace acetophenone or mesityl oxide will participate in the acid-catalysed condensation with acetone, generating chromophoric impurities that persist through the epoxy resin chain and cause unacceptable absorption in the 340–380 nm range for liquid photoimageable soldermask formulations. The phenol is fed into an ion-exchange purification loop packed with sulfonated styrene-divinylbenzene resin in the hydrogen form before entering the BPA reactor, where 2-mercaptopropionic acid promoter at 0.3 wt% on phenol catalyses the conversion at 65 °C. The output BPA, after solvent extraction and recrystallisation, yields 99.9 % purity with free phenol below 0.05 % and an iron content of 0.5 ppm. Epoxy resins produced from this monomer achieve a hydrolyzable chloride content as low as 150 ppm, a prerequisite for the low ionic migration resistance specified in IPC-4101E /126 for FR-4 laminates used in automotive engine control ECU substrates. Failure to meet the chloride limit results in conductive anodic filament formation along glass fibre interfaces after 1 000 hours of 85 °C/85 % RH bias testing at 50 V DC, exceeding the resistance drop threshold of 100 MΩ within 200 hours. The phenol-to-BPA-to-epoxy chain thus directly dictates the insulation resistance stability under IPC-TM-650 2.6.14.1.
A semi-aqueous stripper bath formulated for post-etch polymer residue removal on AlCu metal lines operates at 90 °C with a blend of 35 wt% electronic-grade phenol, 50 wt% N-methylpyrrolidone, 10 wt% 1-amino-2-propanol, and 5 wt% deionised water. The phenolic component swells and dislodges the cross-linked organometallic crust that forms on the sidewalls during fluorocarbon-based plasma etch, while the alkanolamine chelates aluminium fluoride crystals to prevent redeposition. Moisture content is rigidly maintained below 0.5 %: above this concentration, the aluminium corrosion rate measured by electrochemical impedance spectroscopy jumps from 0.3 nm/min to 4 nm/min, accompanied by visible pitting after 15‑minute immersion. The solution is monitored by daily potentiometric titration for the phenol-to-amine ratio, rejecting any lot where the ratio deviates beyond 3.3–3.8. A metal-ion scavenging column packed with iminodiacetic acid chelating resin maintains iron, copper, and nickel each below 10 ppb, consistent with front-end-of-line contamination budgets for 0.18 µm and smaller nodes. The stripped wafers are rinsed in isopropyl alcohol and spin-dried with nitrogen to prevent water marks, then pass a bright-light inspection against MIL-PRF-38535 criteria for residues. This rework process is executed on single-wafer spray tools, not immersion tanks, to confine cross-contamination risk to the reworked wafer alone.
Phenol-formaldehyde novolac of low molecular weight (Mn 800–1 200) is esterified with acrylic acid to a degree such that the acid value remains between 80 and 110 mg KOH/g, ensuring solubility in 1 wt% aqueous sodium carbonate at 30 °C. The resulting phenolic acrylate is blended at 15 parts with 100 parts bisphenol-A epoxy acrylate, 25 parts trimethylolpropane triacrylate, and a 4-part photoinitiator mixture of Irgacure 907/ITX. After screen printing over etched copper traces and exposure at 400 mJ/cm² UV-A dose, the unexposed ink developed off in the carbonate solution within 50–70 seconds, providing sidewall angles steeper than 70° as required by IPC-SM-840E Class T. The adhesion to copper is verified by a crosshatch tape test per ISO 2409 after thermal shock from 260 °C solder float to −65 °C air, where a rating of 0 or 1 is accepted. Once precure and hot-air levelling are completed, the coating resists thermal yellowing at reflow temperatures up to 288 °C because the phenolic backbone has been depleted of oxidisable free ortho positions through selective 2,4-dimethylol stabilisation during the novolac synthesis.
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| Hardener Type | Mix Ratio (phr) | Onset of Cure (DSC, °C) | Tg (TMA, °C) | Moisture Uptake (85 °C/85 % RH, 168 h, %) | CTE Alpha-1 (ppm/°C) | Test Standard |
|---|---|---|---|---|---|---|
| Phenol novolac | 50–65 | 110 | 155–170 | 1.3 | 48 | ASTM D3418, E1545 |
| Dicyandiamide (Dyhard 100S) | 8–10 | 150 | 125–135 | 2.0 | 60 | IPC-TM-650 2.4.25D |
| 4,4′-Diaminodiphenyl sulfone (DDS) | 32 | 165 | 210–230 | 3.2 | 52 | ASTM E1640-18 |
| Parameter | Electronic Grade (This Product) | Industrial Grade | Analytical Method |
|---|---|---|---|
| Purity | ≥ 99.99 % | 99.5 % | GC-FID (ASTM D6142-21) |
| Water | ≤ 0.02 wt% | ≤ 0.1 wt% | KF coulometric (ASTM E1064-24) |
| Total chlorine | ≤ 0.5 ppm | ≤ 5 ppm | Combustion IC (ASTM D7359-18) |
| Sodium | ≤ 0.1 ppm | ≤ 1.0 ppm | ICP-MS (EPA 6020B) |
| Iron | ≤ 0.1 ppm | ≤ 0.5 ppm | ICP-MS |
| Solidification point | 40.8–40.9 °C | 40.6–40.9 °C | ASTM D6875-23 |
| APHA color (molten) | ≤ 5 | ≤ 25 | ASTM D1209-05(2019) |
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